g ? sic ? technology superblue? led C430-CB290-E1000 f e a t u r e s a p p l i c a t i o n s ? high perform a nce ? 1150w ? full color displays & moving message signs ? superior sic substrate technology ? solid state incandescent replacem e nt bulbs ? 465nm dom i nant w a velength ? high am bient panel indicators ? excellent chip to chip consistency ? color printers & scanners ? high reliability ? medical & analytical instrum e nts description cree?s superblue? com b ine highly efficient gan with cree?s proprietary sic? substrate to deliver the ultim ate price/perform a nce for high intensity blue leds. the C430-CB290-E1000 is designed for use in high am bient light conditions with a typical output of 1150 w and a 465nm dom inant wavelength (at 20 m a ). C430-CB290-E1000 chip diagram tops id e view g ? sic ? l e d chip 275 x 275 m mesa ( j un ctio n ) 240 x 240 m gol d b o n d p a d 114 m di am et er a n ode (+) die cros s section t = 250 m b ack s i de me t a llizat io n c a t h ode ( - ) gan si c su b s tr a t e cpr3 l rev . h ? 1998-2003 c r ee, inc. al l r i ght s r e served.
g ? sic ? technology superblue? led C430-CB290-E1000 m aximum ratings at t a = 25c notes 1&3 C430-CB290-E1000 dc forward current 30 m a peak forward current (1/10 duty cycle @ 1khz) 70 m a led junction tem p erature 125c reverse voltage 5 v operating tem p erature range -20c to +80c storage tem p erature range -30c to +100c electrostatic discharge threshold (hbm) note 2 1 0 0 0 v electrostatic discharge classification (mil-std-883c) note 2 class 2 electrical/optical characteristics at t a = 25c note 3 if = 20 ma C430-CB290-E1000 symbol (units) description min. typ. max. v f (v) forward voltage 4.0 4.3 p (w ) radiant flux 850 1150 i (a) reverse current (vr = 5v) 10 i v (m cd) chip lum i nous intensity 6.0 p (nm ) peak w a velength 426 428 430 d (nm ) dom i nant w a velength 462 465 466 ? (nm ) halfwidth 65 (ns) optical rise tim e 30 m echanical specifications note 4 c 4 3 0 - c b 2 9 0 - e 1 0 0 0 d e s c r i p t i o n d i m e n s i o n t o l e r a n c e p-n junction area (m ) 240 x 240 25 bottom area (m ) 275 x 275 25 chip thickness (m ) 250 25 au bond pad diam eter (m ) 114 20 au bond pad thickness (m ) 1.2 0.5 back contact metal w i dth (m ) 19.8 -5, +10 notes: 1) m a xim u m r a tings ar e package dependent. t h e above r a tings we r e deter m ined using a t - 1 3/4 package ( w ith hy sol os4000 epoxy ) f o r characterization. seller m a kes no r e pr esentations r e gar d ing r a tings for packages othe r than the t-1 3/4 package used by seller. the f o rward curr ents (dc and peak) are not lim ited by the g ? s ic die but by the effect of the l e d junction tem p erature on the package. please ref e r to f i gures 5 and 9 f o r specif i c derating curves. the junction tem p er atur e lim it of 125 c is a lim it of the t - 1 3/4 p ackage; junction tem p er atur e should be char acter ized in a speci f i c package to determ ine lim itations. assem b ly processing tem p eratur e m u st not exceed 350c (< 15 m i nutes). 2) pr oduct r e sistance to electr o static dischar g e ( e sd) is m easur ed by sim u lating e s d using a r a pid avalanche ener gy test ( r ae t ) . t h e rae t pr ocedur es are designed to approxim a te the m a xim u m esd ratings shown. seller gives no other assurances regarding the ability of products to withstand esd. 3) all pr oducts confor m to the listed m i nim u m and m a xim u m specifi cations for electr i cal and optical char acter istics, when assem bled and oper a ted at 20 m a within the m a xim u m r a tings shown above. e fficiency decr eases at higher cur r e nts; please r e fer to fig 3 and 7 for specific effi ciency curves. typical values given are the average values expected by seller in large quantities and are provided for inform ation only. seller gives no ass urances products shipped will exhibit such ty pical r a tings. all m easur em ents wer e m a de usi ng lam p s in t - 1 3/4 packages ( w ith hy sol os4000 epoxy ) . optical c haracteristics were m easured in a photoresearch spectrascan i n tegr ating spher e , l u m i nance a. 4) all pr oducts confor m to the listed m echanical specifications within the toler a nces shown. cpr3 l rev . h ? 1998-2003 c r ee, inc. al l r i ght s r e served.
|
